BTP & BTS

Azista delivers vertically integrated Electronics Design & Manufacturing Solutions, providing full lifecycle support: Design → Prototyping → Manufacturing → Lifecycle Management. We offer turnkey solutions for both Built to Print (BTP) and Built to Spec (BTS) projects, with flexibility tailored to customer requirements.

Fabrication & Assembly Services

Hi-Rel Fabrication for Mission-Critical Applications

• Specialization in Hi-Rel qualified processes including space-grade components.

RF & Microwave Payload Subsystems

• Components: 1GBPS X-Band Payload Transmitters, Low Noise Amplifiers, Frequency Converters, Receivers.
• Waveguide Passive Components: Filters, Couplers, etc.
• SDRs: VHF/UHF/L/S/C/X/Ka/Ku Band.

Advanced Hi-Rel Fabrication & Assembly

• Wire Bonding: MMIC, MIC, CMOS.
• Precision Die Bonding: Face Up & Flip Chip (Face Down).
• Automated Surface Mount Technologies (SMT)
• Robotic Selective Soldering: Through-hole (PTH) components.
• Multi-Chip Packaging: MCM, MCP.
• Micro-Optical Package Assembly

Testing & Infrastructure

Space-Grade Testing Facilities

• EMI/EMC testing: Anechoic Chamber (NABL accreditation in process).
• Thermal Vacuum Testing.
• Environmental Stress Screening (ESS).
• High-capacity Sine & Random Vibration & Mechanical Shock Testing (up to 6 ton).

Infrastructure Highlights

• Class-10000 Clean Rooms for MMIC/MIC/PFF assemblies.
• ESD-safe electronic assembly areas with automated SMT lines.
• 2.5D X-Ray system for BGA & fine-pitch inspections.

Quality & Compliance

• Certifications: ISO 9001:2015, AS 9100D:2016, ISO 45001:2018, CMMI Level 5.
• Standards Compliance: CIPC J-STD-001, IPC-A-610.

For the complete list of qualified processes, full testing capabilities, and standards, download the brochure.