FineView

The FineView is an Ultra High Resolution, Electro-optical Payload designed and produced by Azista. It is a next-generation product built for high-quality panchromatic (PAN) and multispectral data at submeter levels.

Purpose and Applications

• Long Lifespan: The payload is engineered for a lifespan of over five years in a Low-Earth Orbit (LEO).
• ISR Support: Its primary application is to support Intelligence, Surveillance, and Reconnaissance (ISR) constellations.
• Earth Observation: It is also used for Fine Resolution Earth Observation.

Salient Features and Performance

• Resolution (GSD): The PAN Ground Sampling Distance (GSD) is 0.47 m.
• Swath: The swath can be up to 22.5 km at 500 km.
• Imaging Bands: The system uses 2x PAN (Offset Pixel Row) and 6x Multispectral spectral bands.
• Sensor Type: It utilizes a Charge-transfer (Analog) TDI (Time-Delay Integration) sensor, featuring Stellar TDI Performance. The imaging is purely Charge Domain Bidirectional.
• Optics Aperture: The clear aperture is 500 mm.
• Product Quality: Excellent Product SNR & MTF (Signal-to-Noise Ratio and Modulation Transfer Function) is achieved.
• Launcher Compatibility: The design is qualified for most launchers.
• Testing & Calibration: Fineview undergoes rigorous on-ground and in-orbit payload test and calibration processes.

Mechanical and Electrical Details

• Mass: The payload's mass is less than 50 kg.
• Envelope: Its dimensions are 650 x 650 x 1250 mm.
• Materials: Both the Main Mirrors and the Structure are made of SiC (Silicon Carbide).
• Thermal Design: It is isolated and autonomous.
• Quantization: The dynamic range is 12 bits.
• Power: The nominal supply voltage is 28 V (Range 18–32 V). The peak power demand when active is 190 W.
• Interfaces: Control & telemetry is supported via RS422 UART/CAN/MIL STD 1553-B/SPACE-WIRE. Data output is through CML SERDES/10G Ethernet.

Imaging and Spectral Specifications

Imaging Performance

• Panchromatic (PAN) Resolution (GSD): 0.47 m.
• Multispectral (MX) Resolution (GSD): Less than 1.4 m at a 500 km orbit.
• Swath: Up to 22.5 km at 500 km.
• Optics Aperture: 500 mm clear aperture.
• Sensor Type: PAN and MX Charge-transfer (Analog) TDI (Time-Delay Integration) sensor. The imaging is purely Charge Domain Bidirectional.
• Quantization: The dynamic range is 12 bits.
• MTF: The Modulation Transfer Function is 11%.

Signal-to-Noise Ratio (SNR)

• PAN SNR (20% Albedo, 60° Solar Elevation): Greater than 125.
• PAN SNR (15% Albedo, 15° Solar Elevation): Greater than 50.
• PAN SNR (Full-Well Capacity): Reaches up to 240.
• Performance Optimization: These performance metrics are achieved with appropriate TDI (Time-Delay Integration) settings.

Spectral Bands

The system uses 2x PAN (Offset Pixel Row) and 6x Multispectral spectral bands.

• Panchromatic (PAN): 400 - 900 nm.
• MX1 (Coastal Blue): 400 - 450 nm.
• MX2 (Blue): 450 - 520 nm.
• MX3 (Green): 520 - 590 nm.
• MX4 (Red): 630 - 690 nm.
• MX5 (Red Edge): 700 - 750 nm.
• MX6 (Near-Infrared): 770 - 890 nm.

For more information, Please download the Broucher

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